LOGICFOLDING YIELD

Model multi-layer bonded wafer yield

Calculate stacked-die yield from independent layer D0 and alpha values plus per-interface bonding yield.

Die Size

Die width mm Die height mm Scribe lane X mm Scribe lane Y mm

Substrate

Wafer diameter mm Substrate cost $ Edge loss mm Notch keep-out mm

Reticle

Reticle width mm Reticle height mm Half-field exposure Auto-optimize placement Reticle offset X mm Reticle offset Y mm Show reticle shot grid Show illustrative background

Layer Stack

Layer count

Stack yield -- %

Good stacks / wafer -- stacks

Bonding yield product -- %

Cost per good stack -- USD

Full dies -- per layer

Partial dies -- edge

Excluded dies -- keep-out

Die per reticle -- grid

Reticle Results

Die per reticle --

Reticle utilization --